You're just talking about a lithography machine. Patterning is one step out of thousands in a modern process (albeit an important one). There's plenty more stuff needed for a production line, this isn't a 3D printer but for chips. And that's just for the FEOL stuff, then you still need to do BEOL :). And packaging. And testing (accelerated/environmental, too). And failure analysis. And...
Also, you know, there's a whole process you'll need to develop. So prepare to be not making money (but spending tons of it on running the lines) until you have a well tested PDK.
Canon has been working on an alternative to EUV lithography called nanoimprint lithography. It would be a bit closer to the idea of having an inkjet printer make the masks to etch the wafers. It hasn't been proven in scale and there's a lot of thinking this won't really be useful, but it's neat to see and maybe the detractors are wrong.
They'll still probably require a good bit of operator and designer knowledge to work around whatever rough edges exist in the technology to keep yields high, assuming it works. It's still not a "plug it in, feed it blank wafers, press PRINT, and out comes finished chips!" kind of machine some here seem to think exist.
I think you are vastly underestimating how a modern fab works. The average cost is 10 billion and takes a about 10 years to build. They are very complex and even the slightest issue can ruin yields. There is a reason why there are so few.
